Opportunities for Process Optimizations with New Silicone Adhesives
Presented by Dow Advanced Assembly Solutions
Join us live Thursday, October 19, 2017 at 3PM CEST (Paris) 9AM EDT
When assembling electronics modules, manufacturers can optimize processes to reduce costs. The choice of adhesive can greatly impact those costs, through the energy use, process time and other factors. Learn about the less-obvious ways that your choice of adhesives can make your process more efficient.
This webinar looks at the newest silicone adhesive technologies and how they are providing more options to optimize your assembly processes. These innovations include Quick-in-Connect (QiC) adhesives, high “green strength” adhesives, Thermal Radical Cure™ adhesives, and the new fast low-temperature cure adhesive (Dow Corning® EA-6060 Adhesive).
The webinar will compare the new silicone adhesives with more-traditional options, discussing cure times, energy needed for curing (if any), adhesion profiles (robustness), pricing, “green strength,” and applications.
Learn more about:
• Quick-in-Connect Adhesives — reactive, hot-melt thermoplastic adhesives that react with moisture to become thermosetting polymers with enhanced physical properties
• Thermal Radical Cure™ Adhesives — a revolutionary “inside out” cure technology provides a rapid, low-temperature cure in just a few minutes, with less sensitivity to oil and contaminants, low/no voiding, and durable adhesion to a wider variety of substrates
• Fast Low-Temperature Cure Adhesives — silicone adhesives that develop robust adhesion at temperatures as low as 80 °C in minutes
This webinar is for manufacturers and designers of a broad range of electronic assembly applications — from automotive electronics to battery packs, communication devices, lamps and luminaires and more. The webinar features Dow’s Florian Damrath, Technical Service & Development Expert, Advanced Assembly Solutions Europe.
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